The Molecular Bond
The ESTWELD ® process provides a way to produce copper to copper, copper to steel molecular bonds with no external energy or heat source. The principle consists of bringing together a welding materials and ignition agent in a suitable graphite mould. The reduction of copper oxide by aluminium produces molten copper and aluminium oxide slag at extremely high temperatures. The shape of the mould, its dimensions, and the size of the welding material, are all dependent on the items to be welded.